ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,908, issued on Aug. 11, was assigned to Resonac Corp. (Tokyo). "Etching method and semiconductor element manufacturing method" was invented... और पढ़ें
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,909, issued on Aug. 11, was assigned to Tokyo Electron Ltd. (Tokyo). "Etching method" was invented by Maju Tomura (Miyagi, Japan), Takatosh... और पढ़ें
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,910, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Hard mask layer and formation m... और पढ़ें
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,911, issued on Aug. 11, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Introduction of metal in hard mask for high aspect r... और पढ़ें
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,912, issued on Aug. 11, was assigned to UTAC Headquarters Pte. Ltd. (Singapore). "Plasma diced wafers and methods thereof" was invented by ... और पढ़ें
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,913, issued on Aug. 11, was assigned to SEMES Co. Ltd. (Cheonan-si, South Korea). "Apparatus and method for processing substrate using supe... और पढ़ें
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,914, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Liquid dispensing system and me... और पढ़ें
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,915, issued on Aug. 11, was assigned to Semes Co. Ltd. (Chungcheongnam-do, South Korea). "Apparatus for treating substrate" was invented by... और पढ़ें
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,916, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Brush assembly and wafer cleaning device inc... और पढ़ें
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,917, issued on Aug. 11, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate processing method and substrate processing devi... और पढ़ें